POST ETCH PUNCH

• 8 CCD camera system views top and bottom image on inner layer


• Positional data of core targets fed into algorithm in database


• Inner layer core optimally positioned prior to punching


• Results: Punch locations within +/- .005mm specified


• Throughput: 6 cores per minute


• Signaled Go-No/Go of top to bottom registration during punch process


• Unsurpassed Repeatability


• One touch / instantaneous changeover of panel sizes


• Automatic calibration of punches to cameras


• AOI guide holes punched simultaneously as lam slots


• Ultra low maintenance costs and down time